SiP refers to a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a convenient compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Drivers & Restraints
The global market is anticipated to rise at a considerable rate during the forecast period. In the recent years, the market was growing at a steady rate and with the rising adoption of strategies by key players; the market is expected to rise over the projected horizon. Increase in demand for high frequency electronic gadgets is expected to provide lucrative opportunities to the market. However, high cost and less customization hamper the market growth.
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2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging
Aerospace & Defense
The market has been segment into North America, South America, Europe, Asia-Pacific, and Middle East and Africa. Asia-Pacific accounted for the largest revenue share in the global market, owing to the increase in demand for semiconductor devices and portable devices.
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Renesas Electronics Corporation
Jiangsu Changjiang Electronics Technology